为智能工厂铺平道路：ADI公司获得CC-Link IE TSN认证

· 未来的制造业将变得更加智能、高效，并实现全面互联。伴随工厂的规模扩张和数字化，打造能够有效管理运营并支持精准控制的集成网络已成当务之急。如今，随着工厂规模不断扩大并采用更智能的技术，构建能够保障顺畅运营并实现精准控制的集成网络比以往任何时候都更加重要。为此，需要从每台设备采集实时数据，即时进行分析，并迅速回传控制信号以优化性能。

整合网络以实现更智能的运营

Analog Devices, Inc. (ADI)的工业以太网时间敏感网络(TSN)交换芯片ADIN6310和ADIN3310成为首批通过CC-Link IE TSN推荐网络配线部件测试的ADI产品，获得CC-Link合作伙伴协会(CLPA)颁发的B类和A类交换芯片认证，具有里程碑意义。 

CC-Link IE TSN的重要性

CC-Link是一项开放网络规范，自2000年起便支持不同制造商的设备之间实现数据通信。CC-Link IE TSN标准是将时间敏感网络引入工厂车间的工业以太网规范，ADI的交换芯片现已通过此项标准认证。TSN提供标准以太网所不具备的高精度时间同步能力，让IT网络与OT网络合而为一，在同一个网络上传输关键的实时数据和非实时数据。这种整合可以实现生产线远程监控，多台设备之间也能实时协调运行，从而提升生产效率、运营效能和作业安全。制造商可采集每台设备的实时数据，即时进行分析，并以极低延迟回传控制信号。结果不言而喻：生产力、效率和安全性全面提升，而这正是智能工厂变革的标志性特征。

ADIN6310和ADIN3310核心解析：性能认证

ADI的工业以太网TSN兼容网络交换芯片ADIN6310 (6端口)和ADIN3310 (3端口)，凭借灵活的以太网端口数量和稳健的多速度运行能力脱颖而出。两者均已获得CC-Link IE TSN认证，支持100 Mbps和1 Gbps连接，并具备时间同步、流量调度和抢占等核心TSN功能。

针对系统制造商，ADI提供了集成交换芯片、PHY、主机处理器和电源单元的评估板，使制造商能够更容易地设计出完全符合CC-Link IE TSN标准的系统。这些产品和评估板已正式量产，并已开始向全球客户发货。

加速智能工厂标准的全球采用

CLPA预计，这项重要的产品认证将加速CC-Link IE TSN在全球范围内的普及，推动世界各地智能工厂的发展。

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关于CC-Link合作伙伴协会(CLPA)

CLPA总部位于日本，在全球11个地区设有分支运营机构。作为开放式网络推广组织，CLPA在推动CC-Link系列的全球采用方面发挥着引领作用，尤其致力于推广CC-Link IE TSN，这是一种基于1Gbps以太网的工业网络，也是业内率先采用时间敏感网络技术的解决方案之一。

关于ADI公司

Analog Devices, Inc. (NASDAQ: ADI)是全球领先的半导体公司，致力于在现实世界与数字世界之间架起桥梁，以实现智能边缘领域的突破性创新。ADI提供结合模拟、数字、AI和软件技术的解决方案，推动自动化与机器人、汽车、能源与数据中心、医疗健康等领域的持续发展，应对气候变化挑战，并建立人与世界万物的可靠互联。ADI公司2025财年收入超过110亿美元，助力创新者不断超越一切可能。更多信息，请访问www.analog.com/cn。

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Forward Looking Statements

This press release contains forward-looking statements, which address a variety of subjects including, for example, our statements regarding expected product solutions, offerings, technologies, capabilities, and applications, including those that may incorporate, or be based upon, software; the value and importance of, and other benefits related to, our product solutions, offerings, and technologies to our customers; expected market and technology trends; and other future events. Statements that are not historical facts, including statements about our beliefs, plans and expectations, are forward-looking statements. Such statements are based on our current expectations and are subject to a number of factors and uncertainties, which could cause actual results to differ materially from those described in the forward-looking statements. The following important factors and uncertainties, among others, could cause actual results to differ materially from those described in these forward-looking statements: economic, political, legal and regulatory uncertainty or conflicts; changes in demand for semiconductor products; manufacturing delays, product and raw materials availability and supply chain disruptions; changes in export classifications, import and export regulations or duties and tariffs; our development of technologies and research and development investments; our future liquidity, capital needs and capital expenditures; our ability to compete successfully in the markets in which we operate; reputational damage; changes in our estimates of our expected tax rates based on current tax law;. For additional information about factors that could cause actual results to differ materially from those described in the forward-looking statements, please refer to our filings with the Securities and Exchange Commission, including the risk factors contained in our most recent Annual Report on Form 10-K. Forward-looking statements represent management's current expectations and are inherently uncertain. Except as required by law, we do not undertake any obligation to update forward-looking statements made by us to reflect subsequent events or circumstances.

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