NXP TEA1713 150W 一体化PC适配器解决方案
来源:中电网 作者:--- 时间:2011-10-13 00:00
NXP 公司的TEA1713集成了PFC控制器和半桥谐振转换器(HBC),通用火线输入电压70 V到276 V (AC),具有过流保护(OCP),过压保护(OVP)和去磁传感,保证在所有条件下安全工作。HBC控制器集成了高压电压转移器,半桥开关频率最大为500kHz,自适应的非重叠时间和突发模式开关,主要用在LCD TV,等离子电视和适配器。本文介绍了TEA1713主要特性,方框图,应用框图和250W LCD TV与70W 笔记本电脑适配器电源电路图,以及采用TEA1713和TEA1795 150W一体化PC适配器电路图,材料清单。
TEA1713 and TEA1795 demo board for 150 W all-in-one PC adapter
The TEA1713 integrates a Power Factor Corrector (PFC) controller and a controller for a Half-Bridge resonant Converter (HBC) in a multi-chip IC. It provides the drive function for the discrete MOSFET in an up-converter and for the two discrete power MOSFETs in a resonant half-bridge configuration.
The efficient operation of the PFC is achieved by implementing functions such as quasi-resonant operation at high power levELs and quasi-resonant operation with valley skipping at lower power levels. OverCurrent Protection (OCP), OverVoltage Protection (OVP), and demagnetization sensing ensure safe operation under all conditions. The HBC module is a is a high-voltage controller for a zero-voltage switching LLC resonant converter. It contains a high-voltage level shift circuit and several protection circuits including OCP, open-loop protection, capacitive mode protection and a general purpose latched protection input.
The high-voltage chip is fabricated using a proprietary high-voltage Bipolar-CMOS-DMOS power logic process that enables efficient direct start-up from the rectified universal mains voltage. The low-voltage Silicon On Insulator (SOI) chip is used for accurate, high-speed protection functions and control.
The topology of a PFC circuit and a resonant converter controlled by the TEA1713 is very flexible, enabling it to be used in a broad range of applications with a wide mains voltage range. Combining PFC and HBC controllers in a single IC makes the TEA1713 ideal for controlling power supplies in LCD and plasma televisions.
Highly efficient and reliable power supplies providing over 100 W can be designed easily using the TEA1713, with a minimum of external components.
TEA1713主要特性:
1. General features
TEA1713 and TEA1795 demo board for 150 W all-in-one PC adapter
The TEA1713 integrates a Power Factor Corrector (PFC) controller and a controller for a Half-Bridge resonant Converter (HBC) in a multi-chip IC. It provides the drive function for the discrete MOSFET in an up-converter and for the two discrete power MOSFETs in a resonant half-bridge configuration.
The efficient operation of the PFC is achieved by implementing functions such as quasi-resonant operation at high power levELs and quasi-resonant operation with valley skipping at lower power levels. OverCurrent Protection (OCP), OverVoltage Protection (OVP), and demagnetization sensing ensure safe operation under all conditions. The HBC module is a is a high-voltage controller for a zero-voltage switching LLC resonant converter. It contains a high-voltage level shift circuit and several protection circuits including OCP, open-loop protection, capacitive mode protection and a general purpose latched protection input.
The high-voltage chip is fabricated using a proprietary high-voltage Bipolar-CMOS-DMOS power logic process that enables efficient direct start-up from the rectified universal mains voltage. The low-voltage Silicon On Insulator (SOI) chip is used for accurate, high-speed protection functions and control.
The topology of a PFC circuit and a resonant converter controlled by the TEA1713 is very flexible, enabling it to be used in a broad range of applications with a wide mains voltage range. Combining PFC and HBC controllers in a single IC makes the TEA1713 ideal for controlling power supplies in LCD and plasma televisions.
Highly efficient and reliable power supplies providing over 100 W can be designed easily using the TEA1713, with a minimum of external components.
TEA1713主要特性:
1. General features
上一篇:松下儿童LED照明电动牙刷上市
下一篇:三星推新一代商用LED拼接显示器
相关文章
led
资讯排行榜
- 每日排行
- 每周排行
- 每月排行
- 集成电路出口暴增88.7%,长鑫中签号出炉,半导体板块跳水
- 上半年我国平均每天生产芯片超过15亿块:高端芯片需求爆发
- 氦气供应全球动荡 中国临时实施氦气出口禁令
- 破局AI算力瓶颈,共筑国产超节点生态——奇异摩尔重磅亮相WAIC,以全栈互联方案引领系统级协同新时代
- 安谋科技Arm China闪耀WAIC | AI前瞻分享,Arm无处不在,让AI触手可及
- 电子元器件销售行情分析与预判 | 2026年Q2
- Melexis扩展免代码单线圈风扇驱动器系列,强力赋能AI GPU散热
- 大联大世平携手onsemi解密3kW SiC图腾柱PFC高密度电源设计挑战
- MathWorks 让 AI 智能体能够在 MATLAB 中执行并验证工程工作流
- 巧用图像传感器模块参考设计(PRISM),简化成像设备从设计到制造的全流程
- 大联大世平携手onsemi解密3kW SiC图腾柱PFC高密度电源设计挑战
- MathWorks 让 AI 智能体能够在 MATLAB 中执行并验证工程工作流
- Melexis扩展免代码单线圈风扇驱动器系列,强力赋能AI GPU散热
- 巧用图像传感器模块参考设计(PRISM),简化成像设备从设计到制造的全流程
- 破局AI算力瓶颈,共筑国产超节点生态——奇异摩尔重磅亮相WAIC,以全栈互联方案引领系统级协同新时代
- 安谋科技Arm China闪耀WAIC | AI前瞻分享,Arm无处不在,让AI触手可及
- 电子元器件销售行情分析与预判 | 2026年Q2
- 集成电路出口暴增88.7%,长鑫中签号出炉,半导体板块跳水
- 上半年我国平均每天生产芯片超过15亿块:高端芯片需求爆发
- 氦气供应全球动荡 中国临时实施氦气出口禁令
- 兆易创新推出首款GD24CL系列I2C EEPROM,完善存储产品线布局
- 兆易创新推出GD33AP236x系列车规级SBC,进一步完善汽车电子布局
- 小鹏汽车:率先落地EIS电池智能管理,以创新领跑未来出行
- 为了您的看球体验,小基站背后的芯片厂商拼了!
- 东芝推出采用最新一代工艺的80V N沟道功率MOSFET,助力提升AI数据中心的效率
- 兆易创新携前沿解决方案亮相2026慕尼黑电子展,多维突破加速产业智能化转型
- 以“In Everything, Better”赋能AI生态,TDK将携最新方案亮相2026慕尼黑上海电子展
- Vishay 34 PHE多匝绝对位置传感器,以更低成本实现高精度和稳定性
- 兆易创新与Qt Group达成全球合作,共筑嵌入式GUI新生态
- 从高性能ADC到完整信号链方案, 士模微电子以自主创新服务中国智造升级






